CMOS image sensor platform enables new functionality for industrial camera design

15-03-2018 | ON Semiconductor | Test & Measurement

ON Semiconductor has released its X-Class image sensor platform, allowing a single camera design to support not only multiple product resolutions but also different pixel functionality. The first devices in the new platform are the 12MP XGS 12000 and 4k/UHD resolution XGS 8000 image sensors. These devices offer high-performance imaging capabilities for applications such as intelligent transportation systems, machine vision, and broadcast imaging. The package sizes of both devices couple with a low thermal profile allowed by the low-power, low-voltage architecture of the X-Class interface to make them fully compatible with compact 29mm x 29mm2 camera designs. “As the needs of industrial imaging applications such as machine vision inspection and industrial automation continue to advance, the design and performance of the image sensors targeting this growing market must continue to evolve,” said Herb Erhardt, vice president and general manager, Industrial Solutions Division, Image Sensor Group at ON Semiconductor. “With the X-Class platform and devices based on the new XGS pixel, end users have access to the performance and imaging capabilities they need for these applications, while camera manufacturers have the flexibility they require to develop next-generation camera designs for their customers both today and in the future.”

By Craig Dyball