New automotive MCU solution for dynamic 3D graphics in hybrid instrument clusters and head-up displays

19-10-2017 | Cypress | Automotive Technologies

Cypress Semiconductor has a new series in its Traveo automotive MCU family with more memory to support a hybrid instrument cluster with 3D graphics and up to six traditional gauges, as well as a head-up display. The highly integrated, single-chip devices in the S6J32xEK series include an advanced 3D and 2.5D graphics engine and provide scalability with the company’s low-pin-count HyperBus memory interface. The series continues Cypress’ expansion of its broad automotive portfolio with differentiated system performance via its MCUs, wireless radios, capacitive-touch solutions, memories and PMICs.

“Our automotive customers are looking to integrate increasingly more dynamic 3D graphics in their hybrid instrument cluster and head-up displays to appeal to consumers,” said Mathias Braeuer, product marketing director of the Automotive Business Unit at Cypress. “Cypress developed our new Traveo MCU series specifically to provide a scalable, cost-effective, single-chip solution to address these applications, and we are pleased to having some of the world’s leading automotive suppliers designing in this solution.”

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