Gold-germanium solder performs well at the elevated operating temperatures

Indium Corporation’s high melting point AuGe solder preforms perform well at the elevated operating temperatures of smaller dies with increased power densities. In addition, improvements in wetting make semiconductor-grade AuGe solder preforms critical for void reduction efforts. Gold-based solders have a melting point ranging from 280C-1064C, making them compatible with subsequent reflow processes. Additionally, gold-based solders are resistant to corrosion, provide superior thermal fatigue resistance, and exhibit excellent joint strength. The company’s Pb-free and RoHS-compliant preforms are available in a variety of standard and custom-engineered designs.