Electronic manufacturer solves complex PCB inspection challenges

16-05-2017 | Nikon Metrology | Subs & Systems

Nikon Metrology has recently provided its high-precision, flat-panel based X-ray inspection system, XT V 160 to help Michigan company, Saline Lectronics inspect its most complex and challenging technical assemblies to the highest standard. To stop the subjectivity of measuring accurate connections in leadless components, the company invested in a Nikon XT V 160 with a Varian 1313Dx flat panel detector and X.Tract technology. This new, high-quality PCB inspection system gives technicians a highly-magnified view at component connections for complex PCBAs. “Our old machine was simply an X-ray,” commented Scott Sober, VP of operations and manufacturing at Saline Lectronics. “The Nikon XT is a proper inspection tool. With it, I will definitively know that my manufacturing process is providing excellent results for all bottom-terminated components.” The Nikon XT V 160 will expose any hidden features allowing further examination into BGAs and other array style package as well as inspect heels of solder joints, fine pitch packages, and internal characteristics of solder joints. With a proprietary NanoTech 160kV X-ray spot and electromagnetic lens, the system offers the latest digital imaging technology available and produces clear, sharp images at the micron level. Jason Sciberras, Saline Lectronics manufacturing manager said: “We chose the Nikon system because of the X.Tract software. The laminography technology gives us an unprecedented, magnified view of any ball underneath a BGA. Even if the BGA has 2,000 balls, I can examine each one individually from any angle. This technology will completely revolutionize how we measure appropriate connections.”
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By Electropages Admin