New dry film negative photoresist for MEMS and wafer-level packaging

Engineered Material Systems has introduced the DF-3560 dry-film negative photoresist for use in micro-electro mechanical systems (MEMS), wafer-level packaging and CMOS applications (TSV sealing). This material formulation has been optimized for hot roll lamination and processing on MEMS and IC wafers. It is available in thickness formats from 5-100µm, ±5%. The cured chemistry can withstand harsh environments including resistance to extreme moisture conditions and corrosive chemicals. The film is tougher (less brittle) than most negative photoresists on the market with a glass transition temperature of 154C (by DMA Tan Delta) and a moderate modulus of 3.25GPa at 25C. It is hydrophobic in nature, providing chemical and moisture resistance. It is compatible with and can be used in contact with their line of spin-coatable photoresists.