Ultra-compact Bluetooth Low Energy modules feature 4.6mm x 5.6mm x 1mm footprint

Mouser now stocks TDK's SESUB-PAN-T2541 ultra-compact Bluetooth v4.0 Low Energy modules in a 4.6mm x 5.6mm x 1mm footprint. The SESUB-PAN-T2541 is based on TDK's proprietary SESUB technology (semiconductor embedded in substrate) and is suitable for use in wearable devices. The Bluetooth die is embedded into a thin substrate along with a quartz resonator, bandpass filter, and capacitors. The module needs only a power supply and antenna. The Bluetooth v4.0 LE specifications significantly reduce power consumption of battery powered devices, and are ideal for wireless healthcare, sport, fitness, home entertainment, and wearable devices.