A 12V output digital DC/DC converter module that offers up to 25A current handling and 300W of power to deliver closely regulated voltages to point-of-load (POL) DC/DC regulators has been developed by power electronics specialists Ericsson.
The module employs Ericsson’s HRR technology and is compatible with the Distributed-power Open Standards Alliance (DOSA) 5-pin eighth-brick footprint standard.
Ericsson claims the module delivers a typical efficiency that exceeds 96% with a 48V input and 12V output at half-load.
The PKB4313D is the first product to be launched from Ericsson’s new high-power PKB-D eighth-brick platform and will be followed by 3.3V and 5V output regulators, as well as additional 12V output modules that will offer different input voltage ranges and power levels.
Meeting the requirements for deployment in distributed power and intermediate bus voltage architectures within the ICT, telecom and industrial sectors, the company says the new module targets high-power and high-performance use in networking and telecommunications equipment, servers and data storage applications, as well as industrial equipment.
The company's HRR topology operates with ratio-regulation in the very-low-input range with the ability to handle transients and sudden changes in input voltage. It also operates in normally regulated fixed-voltage mode from a 42V input and above.
Ericsson also claims that the module's response to line and load transients guarantees the output voltage will remain stable and immune from voltage deviations that are due to power disturbances on the system bus. This retains intermediate bus voltage integrity within the tolerance band required by power system architects.
The module’s power train also employs full-bridge synchronous rectification on the primary side, which is not commonly found in competitive devices in this price range.
The use of tellurium copper pins provides good thermal transport. In addition, FETs are placed on the module’s topside, making it easy to attach a thermal gap pad directly to the FETs and transport heat to an optional base plate to connect the module to a heat sink or cold plate.
By Paul Whytock
Paul Whytock is European Editor for Electropages. He has reported extensively on the electronics industry in Europe, the United States and the Far East for over twenty years. Prior to entering journalism he worked as a design engineer with Ford Motor Company at locations in England, Germany, Holland and Belgium.