Robin Mitchell

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Robin Mitchell is an electronic engineer who has been involved in electronics since the age of 13. After completing a BEng at the University of Warwick, Robin moved into the field of online content creation, developing articles, news pieces, and projects aimed at professionals and makers alike. Currently, Robin runs a small electronics business, MitchElectronics, which produces educational kits and resources.

The Stupidity of “Massless Batteries”

Time and time again researchers and the media report on “game changing” technologies that appear to defy the laws of physics, and the so called “massless battery” is one of them. W

04-08-2022

Researchers Develop Graphene Foam Sensors for Improving Robotic Touch Capabilities

Recently, researchers have developed pressure sensors using graphene foam that can provide prosthetics and robotic systems with accurate haptic capabilities. What challenges do cur

03-08-2022

MIT Researchers Develop Stickers Able to Generate Images Inside the Body

Recently, researchers from MIT have demonstrated a paper-thin sensor that can be stuck onto skin and generate an internal image of vessels and other structures. What challenges do

03-08-2022

MIT researchers create 3D printed sensor for satellites at a fraction of the cost

It is well known that one of the most expensive fields of engineering is aerospace, and specifically, anything that goes into space. Recognising the challenges faced by low-cost sp

02-08-2022

Does Nancy Pelosi’s recent trade suggest a shake-up in the semiconductor industry?

As the CHIPS act makes its way through congress, the husband of Nancy Pelosi has sold off a large number of Nvidia shares while Nancy Pelosi continues to plan her trip to Taiwan. W

Semiconductors | 01-08-2022

Researcher Demonstrate how SATA Cables can be Used to Steal Information

Recently, a researcher from the University of Negev, Israel, demonstrated how a SATA cable inside a PC can be used to wirelessly transmit data from a machine entirely isolated from

01-08-2022

Micron demonstrates 232 layer NAND package with 2TB storage

Recently, Micron announced the release of the world’s first 232-layer NAND chip that offers 1Tb per die and 2TB per package. What challenges do semiconductor technologies face when

29-07-2022

Co-op facing legal challenge of use of facial recognition technology

After two years of use, the Co-op shopping chain is facing a legal challenge over its use of biometric data to track shoplifting suspects and deny access to stores. What technologi

Privacy | 28-07-2022