Modular 3D AOI system for THT solder joint and pins

The SpectorBOX X1 from Mek is a modular 3D AOI system designed specifically for THT inspection, allowing for direct inspection from the bottom side. It provides volumetric measurements of solder joints from selective, wave, robotic, pin-in-paste reflow, and manual soldering processes, ensuring assemblies meet the highest quality standards and catching defects before they impact production.

Built on the company's extensive experience in THT solder inspection, the system provides precise and repeatable 3D measurement data for critical quality control:

• 3D Direct volumetric analysis: Accurate measurement of solder joint volume for complete quality control.
• Pin height measurement: Detect even the smallest deviations in through-hole connections.
• Shape-based solder joint inspection: Evaluate geometry to ensure consistent, reliable results.
• Press-fit penetration evaluation: Identify hidden defects that could compromise performance.
• Advanced glare suppression and shadow minimisation: Ensure measurements are consistent and repeatable.
• High-clearance: Over 100mm (3.9") on the THT solder side for use under various conveyor systems.
• 60mm Z-axis: For inspecting at different heights.

The system delivers actionable, high-quality 3D inspection data:

• Maintain consistent solder joint quality.
• Reduce defects and rework.
• Ensure reliability across every production run.

SpectorBOX X1 complements the company's VeriSpector for manual assembly inspection and connects seamlessly to the Mek Catch system for handling inspection data, including SPC, repair, monitoring, and communication with Manufacturing Execution Systems (MES).