Industrial MOSFETs 650V G2 for medium-power applications with high power density

Infineon Technologies AG has expanded its CoolSiC MOSFETs 650V G2 portfolio with new 75mΩ variants to fulfil the demand for more compact and powerful systems. The devices are available in multiple package options, including TOLL, ThinTOLL 8x8, TOLT, D2PAK, TO247-3, and TO247-4. As a result, the product family supports both Top Side Cooling (TSC) and Bottom Side Cooling (BSC) approaches, offering developers a high degree of flexibility. The devices are excellent for high and medium-power SMPS in different applications, including AI servers, renewable energy, EV and e-mobility chargers, humanoid robot chargers, televisions, and drives.

The MOSFETs are based on the second-generation (G2) of CoolSiC technology, providing improved FoM, higher reliability, and improved ease of use compared to the previous generation. The different packages offer various advantages: TOLL and ThinTOLL 8x8 packages provide high thermal cycle stability on the PCB, enabling compact system designs. When used in SMPS, they lower the space needs on the PCB and lower manufacturing costs at the system level. The list of target applications for TOLL and ThinTOLL 8x8 has been expanded, allowing PCB designers to address cost-reduction challenges. The addition of TOLT strengthens the company's growing TSC product family, which also includes CoolMOS 8, CoolSiC, CoolGaN and Optimos. The TSC variants enable up to 95% direct heat dissipation, allowing designers to utilise both sides of the PCB, thereby improving space utilisation and reducing parasitic effects.

The CoolSiC MOSFETs 650V G2 75mΩ are available now and come in TOLL, ThinTOLL 8x8, TOLT, D2PAK, TO247-3, and TO247-4 packages.