High-performance array connectors provide 800 positions in a low profile

Samtec, Inc. has expanded its AcceleRate HP product line with the release of 800-position APM6 and APF6 high-performance array connectors available in a low-profile 5mm stack height.

Engineered for next-generation demands, the new connectors deliver outstanding signal integrity and density, supporting data rates up to 112Gbps PAM4 on a 0.635mm pitch. These connectors are optimised for high-throughput applications such as HPC, AI, storage, and networking.

Key features include:

• Protocol compatibility with PCIe 6.0, CXL 3.2, and 100GbE
• 800-position configuration (8 rows × 100 positions) in a dense footprint of 68.62mm × 18.20mm (2.701" × 0.717")
• 5mm mated stack height, with a 10mm version planned for Q2 2026
• 5Ω impedance
• 2A max current rating (one pin powered per row), and 150VAC (212VDC) max voltage rating
• Open pin field array design for maximum grounding and routing flexibility
• The APM6 and APF6 connectors utilise the company's Solder Column Termination, enhancing structural integrity. This IPC Class 3 compliant method is excellent for dense, high-speed interconnects, delivering superior solder joint reliability and exceptional insertion loss and return loss performance.

"These new 800-position connectors represent a significant advancement in high-density, high-speed interconnect technology," said Eric Mings, Samtec's High-Speed Board-to-Board product manager. "They're designed to meet the rigorous demands of today's data-intensive systems while maintaining reliability."