First NVMe SSD built for the demands of generative AI environments

KIOXIA Europe has expanded its high-capacity KIOXIA LC9 Series enterprise SSD lineup by introducing the industry's first 245.76TB NVMe SSD in 2.5-inch and Enterprise and Datacenter Standard Form Factor (EDSFF) E3.L form factors. This new capacity and form factor option complements the previously announced 122.88TB (2.5-inch) model and is purpose-built for the performance and efficiency demands of generative AI environments.

Generative AI places unique demands on storage, including the necessity to store vast datasets for training LLMs, and to create embeddings and vector databases that support inference through retrieval augmented generation (RAG). These workloads need storage solutions with large capacity, high speed, and exceptional power efficiency.

Featuring a 32-die stack of 2Tb BiCS FLASH QLC 3D flash memory with innovative CBA technology, the series SSDs deliver the speed, scale, and density needed to support the next wave of AI-centric workloads. This combination of advanced memory architecture and CBA technology enables 8TB in a small 154 BGA package – also an industry first. This milestone was made possible with advancements in the company's high-precision wafer processing, material design, and wire bonding technologies.

The series SSDs are ideal for data lakes, where massive data ingestion and rapid processing are essential. Unlike HDDs, which often bottleneck performance and leave costly GPUs underutilised, SSDs allow dense storage in a compact footprint. By delivering up to 245.76TB, each drive can replace multiple power-hungry HDDs, offering superior performance, lower overall power consumption, fewer drive slots used, and more efficient cooling, which would significantly lower TCO.

KIOXIA LC9 Series SSDs Features Include:

• Up to 245.76TB in 2.5-inch and E3.L form factors
• Up to 122.88TB available in 2.5-inch and E3.S form factor
• Designed to PCIe 5.0 (max. 128GT/s Gen5 single x4, dual x2), NVMe 2.0, and NVMe-MI 1.2c specifications
• OCP Datacenter NVMe SSD specification v2.5 support (not all requirements)
• Flexible Data Placement (FDP) support to minimise write amplification and extend SSD lifespan
• Security options: SIE, SED, FIPS SED
• CNSA 2.0 signing algorithm, designed with future quantum security standards in mind

"We continue to drive innovation with the new KIOXIA LC9 Series, providing cutting-edge technology that enables our data centre and hyperscaler customers to stay ahead," said Paul Rowan, VP and CMO at KIOXIA Europe GmbH. "The 32-die stack of 2Tb BiCS FLASH QLC 3D flash memory coupled with our innovative CBA technology and the E3.L form factor within the LC9 Series SSDs address their unique requirements of Generative AI applications for speed, scale and efficiency."

KIOXIA LC9 Series SSDs are now being sampled for select customers and will be featured at the Future of Memory and Storage 2025 conference from 5 to 7 August 2025, in Santa Clara.