First automotive-qualified SiC MOSFETs in top-side cooled package

Navitas Semiconductor has introduced a new level of reliability to satisfy the system lifetime needs of the most demanding automotive and industrial applications. Its latest generation of 650V and 1200V' trench-assisted planar' SiC MOSFETs combined with an optimised, HV-T2Pak top-side cooled package, delivers the industry's highest creepage of 6.45mm to fulfil IEC-compliance for applications up to 1200V.

These HV-T2PaK SiC MOSFETs greatly increase system-level power density and efficiency while enhancing thermal management and simplifying board-level design and manufacturability. Target applications include EV OBC and DC-DC converters, data-centre power supplies, residential solar inverters and ESS, EV DC fast chargers, and HVAC motor drives.

AEC-Q101 is an automotive industry standard developed by the Automotive Electronics Council (AEC) to establish common part-qualification and quality-system standards. The company has created an industry-first benchmark, 'AEC-Plus', indicating parts qualified above and beyond the existing AEC-Q101 and JEDEC product qualification standards. This new benchmark showcases its deep understanding of system-level lifetime needs and a strong commitment to enabling rigorously designed and validated products for demanding mission profiles in automotive and industrial applications.

The 'AEC-Plus' qualification standards extend further into rigorous multi-lot testing and qualification. Key additions to the existing AEC-Q101 requirements include:

• Dynamic reverse bias (D-HTRB) and dynamic gate switching (D-HTGB) to represent stringent application mission profiles
• Over 2x longer power and temperature cycling
• Over 3x longer duration for static high-temperature, high-voltage tests (e.g. HTRB, HTGB)
• 200C TJMAX qualification for overload operation capability

The company's HV-T2PaK top-side cooled package, in an industry-standard compact form factor (14mm x 18.5mm), is optimised with an innovative groove design in the package mould compound that extends the creepage to 6.45mm without lessening the size of the exposed thermal pad and ensuring optimal heat dissipation.

Also, the exposed thermal pad has NiNiP plating, as opposed to tin (Sn) plating from existing TSC package solutions, which is critical to preserving the exposed pad's post-reflow surface planarity and ensuring thermally efficient and reliable attachment to the thermal interface material (TIM).

Enabled by over 20 years' of SiC technology innovation leadership, the company's GeneSiC' trench-assisted planar SiC MOSFET technology' offers up to 20% lower on-resistance under in-circuit operation at high temperatures compared to competition and superior switching FoM which result in the lowest power losses across a wider operating range. All GeneSiC SiC MOSFETs have the highest-published 100%-tested avalanche capability, exceptional short-circuit withstand energy, and tight threshold voltage distributions for easy paralleling.

The initial HV-T2PaK portfolio includes 1200V SiC MOSFETs with on-resistance ratings ranging from 18mΩ to 135mΩ and 650V SiC MOSFETs with on-resistance ratings ranging from 20mΩ to 55mΩ. Lower on-resistance (<15mΩ) SiC MOSFETs in HV-T2Pak package will be announced later in 2025.