Automotive planar Schottky diodes offered in space-saving packaging

Nexperia now offers a portfolio of 16 new low VF optimised planar Schottky diodes in CFP2-HP packaging. The portfolio includes eight industrial (e.g. PMEG6010EXD) and eight AEC-Q101 qualified (e.g. PMEG4010EXD-Q) products. This release supports the growing trend for manufacturers to replace devices in SMA/B/C type packaging with smaller footprint CFP-packaged devices, particularly in automotive applications. These diodes are suitable for DC-DC conversion, freewheeling, reverse polarity protection, OR-ing applications, and more.

This portfolio extension provides reverse voltages VR(max) ranging from 20V to 60V and forward currents IF(average) of 1A and 2A for maximum design flexibility. The exposed heatsink of the CFP2-HP allows the highest level of heat dissipation (Ptot) at a small package footprint. The CFP2-HP package dimensions are 2.65mm x 1.3mm x 0.68mm (inc. leads).

"As the industry transitions to multilayer PCBs, a trend driven by the increasing popularity of high-performance microcontrollers, packaging becomes a crucial part of the thermal system. Smaller packages like CFP, which offer more efficient heat dissipation, are a core part of Nexperia's commitment to actively contribute to this shift," says Frank Matschullat, product group manager at Power Bipolar Discretes at Nexperia. "Modern CFP packaging technology, designed for multilayer PCBs, offers equal electrical performance on a smaller footprint, reducing part and system costs. With substantial investments in capacity expansion, we are poised to meet the increasing demand for CFP-packaged products. They are essential for future-proofing automotive and industrial applications against the rising demands and ensuring competitiveness in the market."

These packages utilise the copper clip design to meet the challenging demands of efficient and space-saving designs. Today, CFP packaging is employed by different power diode technologies such as Nexperia's Schottky and Recovery Rectifier Diodes and will also be extended to bipolar transistors soon. It delivers significant product diversity. This further solidifies the company's position as a leader in packaging innovation, offering customers the widest range of device options from a semiconductor manufacturer with a trusted supply chain.