New 2-in-1 SiC MOSFET moulded module significantly reduces the size of xEV inverters

17-06-2024 | ROHM Semiconductor | Power

ROHM has developed four models as part of the TRCDRIVE pack series with 2-in-1 SiC moulded modules (two 750V-rated: BSTxxxD08P4A1x4, two 1,200V-rated: BSTxxxD12P4A1x1) optimised for xEV traction inverters. The TRCDRIVE pack supports up to 300kW and features high power density and a unique terminal configuration, which help solve the key challenges of traction inverters in terms of miniaturisation, higher efficiency, and fewer person-hours.

As the electrification of cars rapidly advances towards fulfilling a decarbonised society, the development of electric powertrain systems that are more efficient, compact, and lightweight is currently progressing. However, for SiC power devices that are drawing attention as key components, attaining low loss in a small size has been a difficult challenge. The company solves these issues inside powertrains with its new series.

A trademark brand for the company's SiC moulded type modules developed specifically for traction inverter drive applications, the device reduces size by using a unique structure that maximises heat dissipation area. On top, its fourth generation SiC MOSFETs with low ON resistance are built in – producing an industry-leading power density 1.5 times higher than that of general SiC moulded modules while significantly contributing to the miniaturisation of inverters for xEVs.

The modules are also equipped with control signal terminals using press fit pins allowing easy connection by simply pushing the gate driver board from the top, decreasing installation time considerably. In addition, low inductance (5.7nH) is accomplished by maximising the current path and utilising a two-layer bus-bar structure for the main wiring, contributing to lower losses during switching.

Despite developing modules, the company has established a mass production system similar to discrete products, making it possible to increase production capacity by 30 times compared to conventional SiC case-type modules.


By Seb Springall

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