Expanded surface mount and module package options for 1200V aSiC MOSFETs

14-06-2024 | Alpha and Omega Semiconductor | Power

Alpha and Omega Semiconductor Limited has expanded its package portfolio options available for their second generation 650V to 1200V aSiC MOSFETs. Applicable to many critical applications such as xEV charging, solar inverters, and industrial power supplies, the new package selections provide designers the added flexibility of multiple system optimisation options to further maximise system efficiency while streamlining their manufacturing process.

The first new surface mount package is available for the AOBB040V120X2Q, the company’s new 1200V/40mOhm aSiC MOSFET in a standard D2PAK-7L surface mount package. This AEC-Q101 qualified product is created to replace traditional through-hole packages. It is ideal for applications such as OBCs where efficient cooling can be supplied by vias and backside PCB heatsinks, simplifying the assembly flow and maximising the power density. Also, the low inductance package combined with the fast driver source-sense connection positions these aSiC MOSFETs as one of the most efficient power-switching solutions in the market.

For additional design flexibility, the company is releasing its GTPAK surface mount package with topside cooling features. In designs where a topside-mounted heatsink is viable, the direct heat path from the GTPAK minimises the thermal resistance. It allows higher power dissipation for more effective PCB routing. The first product in GTPAK is the AOGT020V120X2. This 1200V/20mOhm aSiC MOSFET is an excellent solution to satisfy the demands of high-efficiency solar inverter and industrial power supply applications.

Finally, the company announced the AOH010V120AM2 as the first product in its new AlphaModule high power baseplate-less module family. This 1200V/10mOhm half-bridge aSiC module features press-fit pins and an integrated thermistor. It is in a standard footprint module that allows the replacement of multiple discrete devices into a single compact form factor while simplifying both the mechanical and electrical design by providing a clear separation of electrical and cooling paths. Single modules are ideal for residential solar inverters, or several modules in parallel will enable scaling to power levels necessary to drive the needs of fast DC charging stations.

“With the continued growth in EVs, energy infrastructure, and renewable energy, we continue to see increased interest in our aSiC MOSFETs. The expansion of our product portfolio to include these new advanced package options gives our customers the design flexibility they need to take advantage of our superior aSiC performance and continue the trend of pushing power systems to higher density and efficiency,” said David Sheridan, vice president of SiC products at AOS.


By Seb Springall

Seb Springall is a seasoned editor at Electropages, specialising in the product news sections. With a keen eye for the latest advancements in the tech industry, Seb curates and oversees content that highlights cutting-edge technologies and market trends.