Leading engineers into the future with immersive technology resource hub

Mouser is at the forefront of enabling engineers to explore the future of AR and VR through its comprehensive, immersive technology resource hub. In an ever-expanding industry landscape, engineers must continuously enhance their understanding of immersive technology applications. From emerging trends like spatial audio to innovative solutions in healthcare education, the company equips professionals with the knowledge, resources and products needed to thrive in this dynamic field. The resource hub provides engineers and developers with the latest information, news, and trends in VR and AR alongside an extensive variety of products from industry-leading manufacturers.

AR and VR technology is quickly becoming a prevalent aspect of our daily lives, gaining popularity in gaming, entertainment, vocational education and healthcare sectors. Amidst the rapid evolution of this field, designers are tasked with the challenge of staying informed about the latest advancements. Whether seeking introductory insights or delving into intricate technical analyses, the resource hub covers a wide range of topics, from haptics integration and motion tracking to 3D printing and beyond, providing a rich array of resources tailored to diverse needs.

The company stocks the industry's widest selection of semiconductors and electronic components, including the following solutions for immersive technology applications:

The BHI360 IMU from Bosch is a highly integrated, ultra-low-power, customisable sensor that can be used in AR/VR/MR headsets and controller devices. With integrated head orientation, the system can optimise algorithms for step counting, tap detection, gesture detection, and activity recognition.

The LIS2DUXS12 by STMicroelectronics is an ultra-low-power three-axis linear accelerometer. The sensor provides a wealth of data without consuming too much power through its embedded machine-learning core for small-scale smart motion solutions.

The Mira220 2.2 MP NIR enhanced global shutter image sensor from ams OSRAM features a 1600 (H) x 1400 (V) resolution for 2D and 3D machine vision applications. The sensor provides extended reality applications with reduced off-chip processing for enhanced use in low-light and compact forms.

Murata's LBEE5PL2DL high-performance multiprotocol module supports Wi-Fi 6 (IEEE 802.11a/b/g/n/ac/ax) and Bluetooth 5.3 BR/EDR/LE specifications. It features the NXP IW611 wireless chipset for high performance and can be used in IoT, video streaming solutions, and more.