Upgraded IR transceiver modules with longer link distance and improved ESD robustness

20-03-2024 | Vishay | Semiconductors

Vishay Intertechnology, Inc. has upgraded its TFBS4xx and TFDU4xx series of IR transceiver modules for IrDA applications to offer 20% longer link distance and improved ESD robustness to 2kV. With support for data rates up to 115.2kbit/s (SIR) and link distances of 1m, the devices are aimed at wireless communication and data transmission in energy meters and monitors, industrial automation controls, mobile phones, and medical equipment. To increase battery life in portable devices, the modules provide low power consumption with an idle supply current of < 70μA, down to <1μA in shutdown mode.

The series devices each consist of a PIN photodiode, IRED, and low-power control IC in a single package. By upgrading the IR transceivers with the company's latest in-house IC and surface emitter chip technology, the company is ensuring the long-term availability of IRDC products for its customers. As drop-in replacements for existing devices, the modules help save costs by eradicating the necessity for PCB redesigns.

Compliant with the latest IrDA physical layer specification, the TFBS4xxx and TFDU4xxx series devices are backwards-compatible and offered in top- and side-view surface-mount packages. The enhanced solutions provide drop-in, plug-and-play replacements for existing devices in the series.

The devices are RoHS-compliant, halogen-free, and Vishay Green. They are offered in various package sizes and feature a wide operating voltage range from 2.4V to 5.5V and an operating temperature range from -25C to +85C.

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By Seb Springall

Seb Springall is a seasoned editor at Electropages, specialising in the product news sections. With a keen eye for the latest advancements in the tech industry, Seb curates and oversees content that highlights cutting-edge technologies and market trends.