Low power consumption dual-core BLE SoC with integrated flash

23-01-2024 | Renesas | Semiconductors

Renesas Electronics Corporation has introduced the DA14592 BLE SoC, which represents its lowest power consumption and smallest multi-core (Cortex-M33, Cortex-M0+) BLE device. By carefully balancing tradeoffs between on-chip memory (RAM/ROM/Flash) and SoC die size (for cost), the device is ideal for a broad range of applications, including connected medical, asset tracking, human interface devices, metering, PoS readers and ‘crowd-sourced location’ tracking.

Continuing the company’s BLE SoC leadership in lowest radio power consumption, the DA14592 utilizes a new low-power mode to offer world-class, 2.3mA radio transmit current at 0dBm and 1.2mA radio receive current. Also, it supports an ultra-low hibernation current of only 90nA, extending shelf-life for end-products shipped with ‘battery connected’, and ultra-low active current at 34µA/MHz for products needing significant application processing.

From a solution cost perspective, the device typically only requires six external components, offering a best-in-class eBOM. Operating from only a system clock, its highly accurate on-chip RCX removes the necessity for a sleep mode crystal in most applications. Its decreased eBOM, coupled with the device’s small package (offered in WLCSP: 3.32mm x 2.48mm and FCQFN: 5.1mm x 4.3mm) also presents designers with an attractively small solution footprint. The device also includes a high-precision, sigma-delta ADC, up to 32 GPIOs and unlike other SoCs in its class, it offers a QSPI supporting external memory (Flash or RAM) expansion for applications needing extra memory.

The company has integrated all external components required to implement a BLE solution into the DA14592MOD module. It offers customers the fastest time-to-market and lower overall project cost. Emphasis has been placed on the design of this module to ensure maximum design flexibility by comprehensively routing its functions to the outside of the module and using castellated pins for easy/low-cost module attachment during development.

One key application the company is showcasing with the DA14592 and DA14592MOD is ‘Crowd-Sourced’ Locationing. Google recently announced plans to provide a Find My Device crowd-sourced locationing network. The company is committed to delivering best-in-class reference designs with industry-leading power, eBOM and solution footprint for both mobile operating systems as soon as Google’s Find My Device network becomes available. These reference designs will accelerate not only tag designs but also allow manufacturers of products that may be lost or stolen to easily attach the device to their existing product to render their product globally locatable using billions of smartphones, thereby differentiating their products and enhancing end-customer value. The DA14592MOD will also remove the necessity for worldwide regulatory certifications, reducing development costs and speeding up time-to-market.

“The DA14592 and DA14592MOD extend our leadership in Bluetooth LE SoCs with our trademark low power consumption and best-in-class eBOMs,” said Davin Lee, senior vice president and general manager of the Analog and Connectivity Product Group for Renesas. “In addition, we have listened to our customers and continue to expand our product support by offering reference designs for applications such as crowd-sourced locationing, helping our customers to more easily differentiate their products, delivering premium value while maintaining lowest costs.”


By Seb Springall

Seb Springall is a seasoned editor at Electropages, specialising in the product news sections. With a keen eye for the latest advancements in the tech industry, Seb curates and oversees content that highlights cutting-edge technologies and market trends.