Kit enables safe and effective power supply design for AMD/Xilinx FPGAs

13-11-2023 | Mouser Electronics | Test & Measurement

Mouser now stocks the LSP-Kit-OracADJ-X controller from LoadSlammer. Created to be employed in conjunction with the FFED-VC1902-VSVA2197 power test adapter (PTA) and the X-Pod adapter, it supplies a fast and comprehensive method for testing and validating power delivery solutions for AMD/Xilinx SoCs and FPGAs.

The kit allows designers to measure regulator performance under operating conditions to verify power delivery performance. The power test adapter is a form factor equivalent device (FFED) that functions as the DUT. This configuration permits corner testing of voltage regulation, complete thermal emulation, large signal time and frequency domain evaluation. Developers can stress test the power delivery circuitry before fitting their SoC or FPGA.

Also available from the company are the Xilinx Power Test adapter kits. Each adapter kit comprises a set of three FFED test boards with a BGA footprint that reflows onto the PCB pads of the board. Connectors are supplied to connect the Power Test adapter to the Pro Mini 200 LSP or the Pro LSP1000 Remote Sense kit. The Remote Sense kit connects to a PC running GUI test software. The Power Test adapters are designed for AMD/Xilinx Versal AI Core Series and Versal Premium AIE devices.

The controller, FFED power test adapters, and Remote Sense kits are developed to reduce the time to market and expenses associated with FPGA power supply design. LoadSlammer also provides downloadable test plans, measurement techniques, and test vectors for test engineers. Customisation of the tool suite is fast and optimised for use with the Power Design Manager software.

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By Seb Springall

Seb Springall is a seasoned editor at Electropages, specialising in the product news sections. With a keen eye for the latest advancements in the tech industry, Seb curates and oversees content that highlights cutting-edge technologies and market trends.