Tiny low-power solder-down module suits intelligent edge processing

24-08-2023 | Direct Insight | Semiconductors

Direct Insight has released the QS93, a miniature QFN-style SoM providing a low-power, cost-optimised 64-bit solution for intelligent edge processing. Based on NXP’s new dual-core i.MX935 with ARM Cortex-A55 processors, plus RAM, Flash memory and power management, the device measures only 27mm x 27mm square with a height of just 2.7mm and supplies excellent EMC and thermal performance.

Manufactured by Ka-Ro Electronics, the SoMs are offered as cost-effective, solder-down modules on tape and reel packaging, which suits mid- and high-volume production runs because devices are more straightforward to manage and test. However, a socket-ready SODIMM version, TX93, is also offered for low-run and development purposes.

The module’s i.MX935 processor supplies a dual 1.5GHz ARM Cortex-A55 core and a separate ARM Cortex-M33 running at 250MHz. There is 1GB of LPDDR4 RAM and 4GB eMMC Flash available, and various interfaces, including dual USB and dual Ethernet. The i.MX935 also includes an Arm Ethos U-65 microNPU affording energy-efficient implementation of ML tasks.

The i.MX93 processor provides powerful multimedia capability, with a MIPI-CSI camera, a 2D GPU and LVDS display support. NXP’s Edgelock Secure Enclave supplies optimal security features.

David Pashley, Direct Insight’s MD comments: “NXP’s new dual-core i.MX935 processor is getting a lot of attention thanks to its high performance, low power and cost-effectiveness. This new module is very compact, suiting edge computing applications which also demand significant processing power.”

The device supports the full -40C to +85C industrial operating temperature range and comes with a dedicated development system (QSBASE93) supplied with Linux BSP.

By Seb Springall