27-03-2023 | Mouser Electronics | Test & Measurement
Mouser has announced a global distribution agreement with Xvisio Technology, which provides high-performance vSLAM technology for robotics and XR devices. The company will provide customers with Xvisio's integrated sensor fusion SeerSense AIOT camera modules for advanced applications, including AR/VR head-mounted displays, drones, industrial automation, 3D face recognition, and 3D scanning.
The SeerSense XR50 module features an independent vSLAM computing unit without host intervention, making connecting to AR/VR and robotic devices simple. The module offers low power consumption and is housed in a compact 75mm × 14mm × 8.9mm package, providing an excellent solution for space-constrained applications. The module provides multiple working modes via USB 2.0 and optional Bluetooth 5.0 connectivity. The device can be customised for different baseline and ID necessities for design flexibility.
The SeerSense DS80 module features both passive stereo semi-global block matching and active ToF depth engines on a single device, providing a comprehensive solution for vSLAM, depth, vision AI, and computer vision edge computing. The product includes a 13MP RGB camera, dual 2MP fisheye cameras, VGA ToF camera, a high-performance IMU, a USB Type-C port, and an extension GPIO port. With strong onboard computing engines, the device can offload host resource loading and minimise power consumption. The company also provides feature-rich SDKs and tool kits for rapid development, enabling designers to quickly leverage advanced machine perception capabilities.
"Xvisio Technology has been dedicated to spatial perception and human-machine interaction technology for years," said John Lin, president and CEO of Xvisio Technology. "We are enthusiastic about partnering with Mouser Electronics to roll out our products to the industry worldwide for both fast proof of concept development and volume production."