Highly-integrated radiation-tolerant DDR4 memory solution

23-02-2023 | Teledyne e2v | Semiconductors

To assist satellite OEMs in streamlining their system development work and reduce the time and engineering effort involved, Teledyne e2v and Texas Instruments have collaborated on a new radiation-tolerant DDR4 modular platform. This field-proven hardware comprises a 4GB/8GB DDR4T0xG72 DDR4 memory from the company and a TI TPS7H3301-SP DDR termination LDO voltage regulator that delivers a stable supply for the DDR4 module.

Optimised for implementations with acute SWaP constraints, the platform is extremely compact and convenient to use. The constituent components have already undergone extensive space characterisation and qualification procedures to assist designers in attaining long-term operation without SEL and SEU issues.

This platform provides elevated levels of data storage capacity to be accomplished inside a very small form factor. It needs three times less PCB area versus solutions from competitors, and its volume is smaller by a factor of ten.

Versatility is another plus point, with the modular platform being applicable across a broad range of space-grade processors (including the company and others), FPGAs/ACAPs (such as AMD/Xilinx, Microchip, NanoXplore, etc.) and custom-built ASICs.

“Having access to pre-tested, easy-to-integrate hardware is of real benefit to those constructing systems for space deployment,” states Thomas Guillemain, marketing manager for Digital Processing Solutions at Teledyne e2v. “This joint platform results in significant value for our space customers, particularly on SWaP.”

“The DDR4T0xG72/TPS7H3301-SP solution means that space systems will now have access to a small-format module that saves critical board area and offers high power density and verified radiation hardness and reliability,” adds Mark Toth, marketing and applications engineering manager for space-grade power products at TI.

By Seb Springall