Vishay Intertechnology, Inc has released seven new MOSFET and diode power modules for onboard charger applications. Provided in various circuit configurations, the integrated solutions combine high efficiency fast body diode MOSFETs and SiC, FRED Pt, and MOAT diode technologies in the compact EMIPAK 1B package, offering patented PressFit pin locking technology.
They provide all the circuit configurations required for AC/DC, DC-DC, and DC/AC conversion in onboard charging applications – input/output bridges, full-bridge inverters, and PFC – over a wide range of power ratings. Compliant with the AQG-324 automotive guideline, the modules can be combined to supply a complete solution for EV and HEV vehicles, as well as agricultural equipment, e-scooters, railways, and more.
Based on a matrix approach, the devices' EMIPAK package can meet a variety of custom circuit configurations in the same compact 63mm x 34mm x 12mm footprint. This allows higher power density than discrete solutions while offering the flexibility to use each module in different power stages for industrial and renewable energy applications, incorporating plasma cutting, UPS, welding, solar inverters, and wind turbines.
The devices' exposed AI2O3 DBC substrate offers improved thermal performance, while their optimised layout helps to minimise stray inductance for greater EMI performance. The modules' PressFit pin locking technology provides for simple PCB mounting and lowers mechanical stress on the substrate, while their baseless structure improves reliability by decreasing the number of solder interfaces.