IP platforms with pre-packaged supply chains for reduced risk

12-09-2022 | Sondrel | Subs & Systems

Sondrel launched its Architecting the Future series covering the SFA 100 to the SFA 350A last year. These pre-packaged SoC IP architectures offer a fast track for developing a new chip as all that is required is to pick the most appropriate foundry and process, third-party IP, and to incorporate any of the customer’s IP to produce a custom solution. They also reduce the risk by being off-the-shelf. Its supply chain manufacturing service has further decreased risk and TTM as it has created a series of pre-packaged supply chains specifically tailored for each of its Architecting the Future platforms.

Ian Walsh, Sondrel’s VP ASIC Business Development, explained: “Customers need to know the overall budget and time-to-market as key decision points in deciding whether to green light a new chip project or not. The process of turning a chip design into final silicon has many variables such as chip size, which foundry and process node to use, what testing regime to adopt, how to package the device, etc. As our range of SoC architectures gives five starting points, we have been able to reduce all these variables into a small matrix for each. This means we have the relevant data at our fingertips with predefined and costed production routes rather than having to start from scratch every time. In other words, we have used our design and supply chain manufacturing services to create off-the-shelf costing models that complement each of our Architecting the Future platforms.

“A new chip is a major decision for any company, and it is thus vital to mitigate risks. We reduce risks with our pre-packaged SFA designs and now reduce risks further with our pre-packaged supply chain routes for each. Unknowns are virtually removed, giving a clearly defined and well-trodden path from design to shipping silicon, making us the partner of choice to deliver on time and on budget.”

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