Collaboration on analog/mixed-signal flow for 22ULP/ULL process technologies

26-08-2022 | UMC | New Technologies

United Microelectronics Corporation (UMC) and Cadence Design Systems, Inc have announced that the Cadence analog/mixed-signal (AMS) IC design flow has been certified for the UMC 22ULP/ULL process technologies. This flow optimises process efficiency and shortens design cycle time, speeding up the development of 5G, IoT and display application designs to satisfy rising market demand.

UMC's 22nm process provides ultra-low power consumption and ultra-low leakage to fulfil various application necessities, including extended battery life, a small form factor, and strong computing capabilities. The UMC-certified Cadence AMS flow offers a URI, enabling customers better to monitor the circuit's reliability and service life when designing 22ULP/ULL processes while attaining an ideal balance between cost and performance. The AMS flow also comprises an actual demonstration circuit, which users can apply throughout the design to improve efficiency and precision.

The AMS flow consists of integrated solutions and methodologies enabled by the PDK to speed a design to completion. This includes the Virtuoso design platform, including schematic editing, the ADE, and layout XL tool enablement; Spectre AMS Designer, which combines the power of the Spectre X Simulator and the Xcelium Logic Simulation engine to offer consistent and accurate results of designs consisting of transistor, behavioural, timing and parasitic block representations; and Voltus-Fi Custom Power Integrity Solution provides EM-IR analysis, which allows users to input the required EM rules quickly.

"UMC is committed to providing leading foundry solutions and advanced speciality technologies that meet the requirements of applications in fast-growing markets such as 5G, IoT, and display," said Osbert Cheng, vice president of device technology development and design support at UMC. "When compared with 28nm capabilities, UMC's 22ULP/ULL process technologies can reduce chip die area by 10%, provide better power efficiency, and enhance radio frequency performance. Through this collaboration with Cadence, we are providing customers with an industry-leading design solution, enabling greater efficiency and speeding time to market."

"With the increasing design complexity of 5G, IoT, and smart wearables, enhancements in analog and mixed-signal technology are critical for the success of advanced IC designs," said Ashutosh Mauskar, vice president, product management in the Custom IC & PCB Group at Cadence. "The Cadence AMS flow that has been optimised for use on UMC's 22ULP/ULL process technologies provides customers with comprehensive solutions across design, verification and implementation. By collaborating with UMC, we're enabling mutual customers to rapidly achieve innovative mixed-signal designs on 22ULP/ULL."