Molex now offers the commercial availability of its Quad-Row Board-to-Board Connectors, providing the industry’s first staggered-circuit layout for 30% space savings over traditional connector designs. These patent-pending connectors provide product developers and device manufacturers more significant freedom and flexibility to support compact form factors, including smartphones, smartwatches, wearables, game consoles and AR/VR devices.
“Molex continually drives connectivity innovations in support of increasingly smaller yet more powerful devices,” said Justin Kerr, vice president and general manager, Micro Solutions Business Unit, Molex. “With the high-density, Quad-Row Board-to-Board Connectors, our customers now can squeeze more features, sensors and functionality into increasingly tight spaces without compromising device performance. As a result, Molex is setting a new connectivity standard for space optimization.”
The connectors adhere to the 3A current rating, fulfilling customer needs for high power in a compact form factor. Further, the product aligns with the standard, soldering pitch of 0.35mm to expedite volume manufacturing using typical SMT processes. Reliable, robust performance is assured, due to interior armour and insert-moulded power nail, which safeguard pins from damage throughout volume manufacturing and assembly. These capabilities, together with wide alignment, enable easy, secure mating and lower fallout rates.
The compact size and reliable performance of the connectors make them ideal for various applications needing increasingly smaller PCBs and flex assembles. The ability to fulfil product miniaturisation demands forms nearly limitless opportunities for AR/VR, automotive, communications, consumer, defence, IoT, medical and wearable applications.