Nexperia has released 14 rectifiers for power applications in its new CFP2-HP (Clip-Bonded FlatPower) packaging. Offered in standard and AECQ-101 versions, these comprise 45V, 60V and 100V Trench Schottky rectifiers (with 1A and 2A options), including the PMEG100T20ELXD-Q, a 100V, 2A Trench Schottky barrier rectifier. For applications needing hyperfast recovery, it has also added the 200V, 1A PNE20010EXD-Q rectifier to the portfolio.
In modern car architectures, the number of ECU is gradually being reduced in favour of fewer high performing, feature-rich ECUs responsible for front axle, rear axle and body control. Consequently, the component density of these units is dramatically increasing. Manufacturers increasingly rely on modern multilayer PCBs to produce these higher density designs. The vertical thermal design on these multilayer PCBs allows designers to save up to 75% of board space with CFP2-HP compared to employing a device in an SMA package while still keeping the same level of electrical performance. This rugged package design allows longer operating times and better board-level reliability, while the new lead shape improves AOI.
“With the switch to smaller packages like CFP being now well underway, Nexperia is aiming to be the driving force that further accelerates this transition,” according to Frank Matschullat, product group manager Power Bipolar Discretes at Nexperia. “Nexperia has invested heavily to expand its capacity to serve the growing demand for CFP-packaged products stays well ahead of market projections for the next three years. These diodes are the latest additions to over 240 CFP-packaged products which Nexperia currently offers.”
Today, CFP packaging is employed by different power diode technologies such as the company's Schottky, silicon germanium and recovery rectifiers but can also be expanded to bipolar transistors. It offers significant product diversity, simplifying board design, covering single/dual configuration and currents between 1-20 A.