Plasma dicing and MPW processing services

UTAC Holdings has underlined its strength in advanced wafer process solutions. The company has added state-of-the-art plasma dicing and multi-project wafer (MPW) capabilities to its variety of advanced semiconductor manufacturing solutions.

Plasma dicing enables narrow scribe street width between dies, following in the increased number of dies per wafer. It gives 'near-perfect' dicing quality with no chipping and/or cracking and is a differentiated advantage over the traditional mechanical sawing process, which produces chronic sidewall quality issues.

Furthermore, plasma dicing facilitates the processing of different die in the same wafer. MPW enables sharing mask and wafer processes, allowing semiconductor companies to decrease overall cost and time-to-market by validating several designs utilising a single wafer. Qualification of new chips becomes far faster with a shorter development cycle time. Also, with 100% die utilisation, there is waste-free dicing. After dicing, the different MPW dies sizes can be reconstituted on separate wafer frames for shipment to the customers. This new capability allows the company to provide full turnkey MPW services.

“I am very pleased to be one of the first OSAT’s to have successfully implemented plasma dicing in our Singapore facility”, says Dr John Nelson, president and CEO at UTAC. “With my IDM background, I am well aware of the benefits of being able to increase the device quantity per wafer and, more importantly, the benefits of being able to dice multi-project wafers, which can significantly shorten the cycle time of new product introduction”.