SMD TOLL format can reduce equipment size and improve efficiency

15-03-2021 | Toshiba | Power

Toshiba Electronics Europe GmbH has released five 650V superjunction power MOSFETs housed in the new compact SMD package in TO-leadless (TOLL) format. Measuring only 9.9mm x 11.68mm x 2.3mm (WxLxH), the TK065U65Z, TK090U65Z, TK110U65Z, TK155U65Z and TK190U65Z devices offer a 27% smaller footprint than the conventional D2PAK package.


The lineup has been expanded to products in the DTMOS VI series with low On-resistance down to 65mOhm. Also, the four-pin package incorporates the option of a Kelvin source. This capability can decrease the parasitic inductance of the source wire in the package and improve switching efficiency by suppressing oscillation.


Deploying the latest generation of the series assists engineers to reduce the size of their end equipment and better efficiency. The device targets the highest efficiency switching with best in class FOM: Rds(on) x Qdg.


Typical applications include server power supplies in data centres, solar (PV) power conditioners, UPS and other industrial applications.

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