Ultra-dense and high-speed interconnects for fast signalling applications

11-09-2020 | RS Components | Connectors, Switches & EMECH

RS Components now stocks the AcceleRate HD range of ultra-dense micro interconnects from Samtec. These high-performance, space-saving mezzanine strips offer high-speed Edge Rate contacts and open-pin-field design for better flexibility and simplicity of integration. They are excellent for applications requiring fast, clean signalling, from broadcast video through to optical systems.

The devices are supplied in a highly dense design with up to 240 I/Os (4 rows with 10-60 positions each). Just 5mm high x 5mm wide, it is a low-profile, ultra-slim solution that saves space and is simple to integrate into current ICs. Its inventive solder ball technology allows simplified processing and self-aligning, decreasing installation time. There are also various stack height (7-16mm) and mount options offered (right-angle and cable in development) to fit a mixture of application needs.

Another key advantage of utilising the solution is its flexibility. It is provided in an open pin-field design allowing more grounding and routing options. Also, its ADM6 surface mount header, providing 56Gbps PAM4 performance, is compatible with both the UMPT and UMPS series, enabling flexible, two-piece power/signal solutions.

Other key features incorporate the high-speed Edge Rate contact system that is created, simulated and optimised for 50Ohm and 100Ohm systems to enhance signal integrity performance. The milled surface of the contact produces a smooth mating surface, which decreases wear on the contact, enhancing durability.

The range is compatible with PCIe Gen 5 and supports 56Gbps PAM4 (28Gbps NRZ) applications. It is currently offered in two series: ADM6 0.635mm Four-Row Terminal and ADF6 Four-Row Socket.

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