Toshiba Electronics Europe continues to drive innovation forward in optoelectronics with the addition of more photorelays to its extensive portfolio. All three of these devices are housed in the new P-SON4 package format. They can deliver extremely strong performance characteristics while taking up notably less board space than typically used SOP packages.
The TLP3480, TLP3481 and TLP3482 each have OFF-state output terminal voltage ratings and ON-state current ratings that are similar to larger SOP-packaged devices - with these parameters ranging from 30V and 4.5A (for the TLP3480), 60V and 3A (TLP3481) to 100V and 2A (TLP3482). They also have low ON-resistance figures, due to inclusion of the company's proprietary trench MOSFET technology.
With 2.1mm x 3.4mm (typ) dimensions, the new P-SON4 package format provides a very small mounting area. This means the photorelays are ideal for high-density board mounting, where there is extremely limited space available. Their 7.2mm2 (typ) mounting area is approximately 74% smaller than 2.54SOP4 and 84% smaller than 2.54SOP6 package types.
These highly compact photorelay devices are targeted for use in a broad variety of measuring equipment and instrumentation – with semiconductor testers, probe cards and I/O interface boards among the key applications gaining benefits.