Compact-sized photorelay devices optimised for high-density implementations

17-09-2020 | Toshiba | Connectors, Switches & EMECH

Toshiba Electronics Europe continues to drive innovation forward in optoelectronics with the addition of more photorelays to its extensive portfolio. All three of these devices are housed in the new P-SON4 package format. They can deliver extremely strong performance characteristics while taking up notably less board space than typically used SOP packages.

The TLP3480, TLP3481 and TLP3482 each have OFF-state output terminal voltage ratings and ON-state current ratings that are similar to larger SOP-packaged devices - with these parameters ranging from 30V and 4.5A (for the TLP3480), 60V and 3A (TLP3481) to 100V and 2A (TLP3482). They also have low ON-resistance figures, due to inclusion of the company's proprietary trench MOSFET technology.

With 2.1mm x 3.4mm (typ) dimensions, the new P-SON4 package format provides a very small mounting area. This means the photorelays are ideal for high-density board mounting, where there is extremely limited space available. Their 7.2mm2 (typ) mounting area is approximately 74% smaller than 2.54SOP4 and 84% smaller than 2.54SOP6 package types.

These highly compact photorelay devices are targeted for use in a broad variety of measuring equipment and instrumentation – with semiconductor testers, probe cards and I/O interface boards among the key applications gaining benefits.

By Natasha Shek