Solder-down module solves production challenges

30-06-2020 | Direct Insight | Semiconductors

Direct Insight has released the tiny QSMP Solder-down module with STMicro ST32M1 single/dual-core ARM Cortex-A7, manufactured by the company’s long-standing partner, Ka-Ro Electronics. The module’s family processor provides a single or dual 650MHz ARM Cortex-A7 core as well as a separate ARM Cortex-M4 running at 200MHz. Also featured is up to 512MB of DDR3L RAM, up to 4GB eMMC Flash, and a variety of interfaces. As well as very low-power operation, the ST32M157C can provide a powerful 3D GPU, secure boot and an AES/TDES/SHA crypto-engine.

The new SoM measures 27mm square and only 2.3mm high. It offers a solder-down package with a QFN-type pin-out based on a 1mm pitch with 100 edge-located pads. This design aids inspection and simplifies routing, even permitting a two-layer baseboard and a base plane. An innovative ground plane design assures that the modules effectively ‘float’ into position through reflow, unlike a BGA which need x-ray inspection to give full connectivity. Furthermore, these QS solder-down modules are so small that warping does not occur.

The design of the package also enhances thermal efficiency and EMI performance as the base functions as both a ground pad and a thermal conductor. Modules operate over an industrial temperature range of -40C or -25C to +85C.

Comments David Pashley, Direct Insight’s MD: “Solder-down SoMs offer simplicity and reduced cost but can be tricky to handle during production. Ka-Ro’s QS modules address these challenges, simplifying inspection and PCB layout while delivering huge processing power - all in a miniature package.”

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