SMD thermal jumper chip removes heat from electrically isolated components

Vishay Intertechnology has released the ThermaWick THJP series surface-mount thermal jumper chip. The Vishay Dale Thin Film device enables designers to transfer heat from electrically isolated components by implementing a thermal conductive pathway to a ground plane or common heatsink.

Providing an aluminium nitride substrate with a high 170W/mK thermal conductivity, the chip can reduce the temperature of connected components by over 25%. This reduction enables designers to increase the power handling ability of these devices or extend their serviceable life at existing operating conditions while sustaining the electrical isolation of each component. By shielding adjacent devices from thermal loads, overall circuit reliability is increased.

The devic's low capacitance down to 0.07pF makes it an attractive choice for high frequency and thermal ladder applications.

Typical areas of use include power supplies and converters; RF amplifiers; synthesisers; pin and laser diodes; and filters for AMS, industrial, and telecommunications applications.

The device is provided in six case sizes from 0603 to 2512, with custom sizes available. The 0612 and 1225 cases feature long side terminations for further heat transferring capability. The thermal jumper is offered with lead (Pb)-bearing and lead (Pb)-free wraparound terminations.