Mouser now stocks the MOD_CH101 ultrasonic ToF sensor module and DK-CH101 SmartSonic platform from InvenSense, a TDK Group company. The ToF solutions provide fast and accurate range measurement with ultra-low power consumption and can detect objects of any size, colour, and transparency. The highly accurate devices are ideal for a range of applications, including IoT devices, augmented reality, drones, and mobile devices.
The InvenSense MOD_CH101 ultrasonic ToF sensor module facilitates rapid integration of the Chirp CH-101 sensor. The device is a highly integrated system-in-package featuring an ultra-low-power SoC together with a piezoelectric micro-machined ultrasonic transducer. Constructed employing patented MEMS technology from Chirp, the module operates advanced ultrasonic DSP algorithms and gives accurate range measurements to targets at distances up to 1.2m. The module comprises an acoustic housing that enables engineers to customise the sensor’s FoV up to 180 degrees and provides for simultaneous range measurements to multiple objects within the FoV. The device is additionally immune to ambient noise.
The InvenSense DK-CH101 SmartSonic platform includes an on-board CH-101 sensor and a Microchip SAM G55 microcontroller with an Arm Cortex-M4 core. This robust development board can connect up to four external MOD-CH101 sensor modules through flat-flex cables. Offering an onboard embedded debugger, the platform can debug the SAM G55 with no external solutions required. The platform incorporates a comprehensive set of software tools, comprising embedded drivers, a GUI-based development tool, and SonicLink (available for download to registered developers).