New connectors deliver high performance in vertical configurations

19-09-2019 | Molex | Connectors, Switches & EMECH

Molex has released the MicroTPA 2.00mm Wire-to-Board and Wire-to-Wire Connector System, giving electrical and mechanical reliability in a high-temperature design that satisfies a wide range of industry demands. The connectors are excellent for the consumer and automotive markets requiring a compact wire-to-board and wire-to-wire connector system, with a current rating up to 2.5A for employment within constrained spaces.

The system has the advantage of two to 15 circuits in a wire-to-wire connector system, acceptance of an extensive variety of wire sizes, crimp terminals that are popular in the market, a positive lock structure, TPA retainers, RoHS compliant and high-temperature capabilities, vertical through-hole headers and a 2mm pitch.

“The new MicroTPA Connector System is designed to withstand harsh environments,” said Mariko Okamoto, global product manager, Molex. “For example, a raised bottom and ledge on the connector allows potting material to cover the entire PC board, preventing water from entering the connector and eliminating otherwise typical conductivity issues.”

In comparison to similar connector systems, the system provides 2.5A amperage, a temperature range of -40C to +105C and a cable range of 0.85mm to 1.5mm.

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