Laird Performance Materials has produced a hybrid thermal and EMI absorber material that supports 5G handheld device and network infrastructure applications. The CoolZorb 5G is specially created for the mmWave and microwave frequencies that 5G will execute. The multifunctional product works as a heat-mitigating gap filler and EMI-reducing absorber to optimise 5G system performance.
Employed like a conventional thermal interface material between heat sources, such as an IC, heat sink or other heat transfer device or metal chassis, the product is an outstanding thermal conductor for heat dissipation. The product functions to suppress undesired energy coupling, resonances or surface currents producing board level EMI issues. By addressing both heat challenges and EMI, the product allows engineers to reduce the design cycle and move their 5G products to market faster.
"There is a misconception that if protective components like absorbers are required, somehow the design is fundamentally flawed. With 5G it is almost impossible to design around protective components like absorbers, which increase in effectiveness at higher frequencies and can help address heat sink-generated EMI issues at mmWave," said Paul F. Dixon, material scientist at Laird Performance Materials. "While there is no one-size-fits-all solution to EMI and heat challenges in 5G technology, multifunctional products like the CoolZorb 5G allow engineers to address EMI and heat issues simultaneously and save space within devices."
The hybrid thermal and EMI absorber material is offered in standard sheet sizes of 18" x 18", in thicknesses ranging from 0.04" - 0.2" (1mm- 5.1mm).