TTI Europe now offers ITT Cannon’s MDM and MDV Micro Series connectors for data, power and signal transmission. Optimised to save space and weight in demanding applications, including defence systems, space vehicles and oil exploration equipment, the connectors are moisture-sealed and rugged. These data, power and signal interconnects blend versatility with high performance and high reliability, and are created to be equivalent to MIL-DTL-83513-style connectors.
The series is offered in eight shell sizes, and provide nine to one hundred contacts (copper alloy or gold plated) in positions 9, 15, 21, 25, 31, 27, 51 and 100. Wire sizes are AWG 24 to AWG32. The interconnects employ the company's field-proven micro twist pin contact system, which reverses the conventional pin and socket arrangement and assures that the pins will mate even under misalignment situations. Highly robust, the series can withstand 500 mating cycles. Configurations include MDM; coaxial/power, PCB, surface mount, micro strip, hermetic, filter, centre jackscrew and circular connectors.
Across the series, there are three temperature variations: the Micro MDM Standard at -55C to +150C, the High Temp Micro MD F222 Series at -55C to +200C, and the Ultra-High Temp Micro MDM F300 Series covers -55C to +230C.