New board kit speeds LTE IoT connectivity development

28-11-2018 | RS Components | Development Boards

RS Components now offers the Renesas Synergy AE-CLOUD2 kit from Renesas Electronics. The kit allows rapid evaluation, prototyping and development of LTE-cellular IoT cloud-connected applications.

The kit helps embedded developers to swiftly and easily connect IoT devices and sensors to global cloud services via cellular (Note), Ethernet or Wi-Fi communications. It also enables them to evaluate new narrowband LPWAN cellular radio options including the CAT-M1 and NB-IoT protocols, which have been specifically developed for use in IoT applications.

The kit’s main processor board has a Renesas Synergy S5D9 MCU, which integrates a 120MHz Arm Cortex-M4 processor core, 2MB of code flash memory, up to 640KB of SRAM and 64KB of data flash. The MCU’s flash memory ability is extended with an external 32MB memory device connected via a high-speed quad-SPI interface, which is perfect for the storage of graphics and other digital assets. The kit provides a wide sensor selection including devices for sensing sound, light, humidity, temperature, pressure and air quality, as well as accelerometer and gyroscope measurement devices, and a geomagnetic sensor for compass navigation.

The kit can connect to different IoT cloud platforms as well as the Renesas Synergy Enterprise Cloud Toolbox. This is a demo application that allows the fast connection to major cloud services, including Amazon Web Services, Microsoft Azure or Google Cloud, to display a web dashboard for visualising sensor data.

The kit can be used globally with support for Cat-M1, Cat-NB1 and 2G/EGPRS, as well as GPS. It also complies with global regulatory certifications for FCC, CE, RoHS, WEEE and Japan MIC. Contents of the kit include the Synergy S5D9 MCU board, Wi-Fi and LTE-CATM1 connectivity boards, plus cellular and GPS antennas, and USB and Ethernet cables.

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