New 8Gb DDR3 components small enough to fit on majority of existing layouts
20-02-2018 |
I'M Intelligent Memory
|
Semiconductors
I'M Intelligent Memory offers their newest revisions of 8gb DDR3L components. The devices include x8 (1Gx8) configurations in FBGA 78 ball package and x16 (512Mx16) types in FBGA 96 ball package. Choice of devices has either a single Chip-Select (1CS) or dual Chip-Select (2CS) pinout.
All of the company's 8gb devices support DDR3L low-voltage (1.35V) operation and fully backward-compatible with standard DDR3 1.5V operation. The products are also available in commercial as well as industrial temperature ranges.
With dimensions of only 9mm x 10.6mm for the FBGA78 and 9mm x 13.5mm for the FBGA96 package, the devices are small enough to fit on a majority of existing layouts.
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