Thin film wire bond resistors offer wide customization capabilities

26-05-2017 | AVX | Passives

AVX Corporation has released the new WBR Series thin film wire bond resistors. Diced to small 0202 (0.02" x 0.02") chip outlines with extremely tight dimensional tolerances (±0.003"), WBR Series top-contact, bottom-isolated resistors are ruggedly constructed, rated for up to 250mW DC power, and deliver ultra-stable, high-reliability performance in low profile packages. The series also offers customizable resistive values spanning 1ohm to 4Mohm with chip markings to match, in addition to film, substrate, termination materials, TCR values, and resistive tolerances. Designed for use in applications that require stable thermocompression, epoxy, or ultrasonic bonding attachment, WBR Series resistors are ideal for use in: hybrid circuits, medical implantable devices, MCM, test and measurement instrumentation, high-reliability microelectronics, and defense applications, amongst others. The series is testedto MIL-STD-202 MTD 106, 107, and 108, as well as MIL-PRF 55342.

"Our new WBR Series wire bond resistors are available in a wide range of resistive values and with several other material and performance customization options to provide ultra-stable, high-reliability solutions capable of meeting a variety of exact application specifications across a range of markets," said Larry Eisenberger, principal technical marketing engineer, AVX. "The chips also come with unique value markings for easy identification."

Standard design and material options for the resistors include: 0202 chips with silicon or glass substrate material, SiCr or TaN film, and bondable gold or aluminum terminations. Standard performance options include resistive values spanning 1ohm to 4Mohm, four TCR values: ± 25, ±50, ±100, and ±150ppm/C, and four tolerance values: 5%, 1%, 0.5%, and 0.1%. However, all of these standard offerings may be customized to suit individual application requirements.

Related product news