New entry into power semiconductor market offers wide variety of package configurations
31-03-2017 |
D3 Semiconductor
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Power
D3 Semiconductor has announced its entry into the power semiconductor market with the launch of its +FET line of 650V-rated superjunction MOSFETs. They enable high-efficiency solutions for a range of hard-switched applications, including PFC boost and inverters used in telecom, enterprise computing, UPS and solar.
The new product roll-out includes over 50 devices with 13 different RDS(ON) ratings ranging from 1000mOhms to 32mOhms. Packages types include: traditional thru-hole (TO-220/TO-220FP), surface-mount (DPAK/D2PAK) and advanced surface-mount (5x6/8x8) devices. For all package sizes and ratings, the company’s devices exhibit a Qg RDS(ON) FOM (Figure of Merit) that is among the highest available.
"In addition to the +FET's excellent performance and reliability, our roadmap is changing the DNA of power devices by infusing mixed-signal functions into high-voltage switching devices," said Tom Harrington, D3 Semi's chief technology officer.
"The initial product lineup of +FET devices are high-performance superjunction MOSFETs that offer socket-for-socket alternatives to competitive parts," said Marty Brown, senior consultant for D3. He further added: "Their capabilities place more control into the designer's hands so that systems can be optimized for power density while reducing design cycle time. Extensive benchmarking of these products is already proving their world-class, competitive performance."
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