New electronic adhesive for delicate structures

15-12-2016 | DELO | Design & Manufacture

DELO has introduced a new electronic adhesive featuring very thin and high walls at the same time. DELOMONOPOX GE7985 has been developed for automotive and industrial applications requiring high reliability in combination with miniaturized designs.

The new adhesive has smaller fillers than previous products of the company's ‘dam-and-fill’ range, allowing it to be applied with needles of a minimum diameter of 250µm, which is important given the increasing miniaturization in electronics. Thanks to an exceptionally high viscosity of 160,000mPas, the adhesive additionally provides high flow resistance and an aspect ratio of 2.5. This means that the height of an adhesive bead can be more than twice its width, without the bead collapsing.

These characteristics make the easy-to-handle adhesive perfectly suited for finest structures such as high separating walls between sensors, for example, which require little width. Stacking of bead layers, known as “dam stacking”, is possible without curing in between. In addition to these design options, the adhesive ensures high reliability. Its outstanding properties include an extended service temperature range up to 200C, low water absorption, and very good chemical resistance to acids, oils, and other aggressive media.

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