New single module designed for long life-cycle applications

03-11-2016 | Concurrent | Subs & Systems

Concurrent Technologies announces the AM F5x/msd, a new AdvancedMC single module based on the Skylake microarchitecture Intel Xeon Processor E3-1500 v5 family. With high performance PCI Express (PCIe) Gen 3 connectivity on the backplane, the device is designed for use in long life-cycle applications within the test, wireless, scientific and semiconductor markets.

Users are able to specify a choice of processors including the Intel Xeon Processor E3 1505M v5 or Intel Xeon Processor E3-1505L v5, these are both 4-core devices with Intel HD Graphics P530 and optimised for compute performance and low power consumption respectively. Alternatively, those customers with GPU intensive applications, can specify a version of the device fitted with the four-core Intel Xeon Processor E3-1515M v5 which has Intel Iris Pro Graphics P580 capabilities. The processing capability is complemented with 16GB of soldered down DDR4 ECC DRAM for reliable, high speed memory access speeds and a removable solid state disk module with up to 128GB capacity for the Operating System, application code and data storage. For connection to additional AdvancedMC modules, the module can be used in a x4 or x8 PCIe lane configuration giving a maximum throughput of 7.8GB/s across the fabric interface. External connectivity includes a range of standard I/O interfaces including two 10GBASE-T Ethernet connections for high speed networking.

Glen Fawcett, CEO of Concurrent Technologies, commented: "Our AdvancedMC modules appeal to a wide variety of applications and markets. Their modularity and relatively small form-factor makes it easy to create high performance embedded compute functions by inserting them into a backplane or carrier. Following on from our successful AM 91x/x1x series of modules, AM F5x/msd provides a useful performance increase with improved networking and extends our expected longevity for AdvancedMC modules beyond 2021."