Improved 80x80 sensor optimised for easy integration into assembly processes for mass production

Ulis has announced the availability of Micro80 Gen2, an advanced functionality thermal sensor. The fully digital device not only supports standardised interfaces (i.e. I2C and HSync/VSync clocking) it also contains a series of improved characteristics, which make it ideal for large-volume applications and for easy integration into assembly processes. It features novel packaging solutions claiming to be the first BGA infrared sensor box packaged in a JEDEC tray. It is designed using a UWLP with vacuum technology; this allows it to support optical fields of up to 120 degrees. It is the first infrared sensor with a unique plastic lens holder, eliminating the need for the user to develop its own, thus saving time and lowering costs. The device consumes less than 55mW. This further extends the battery life and the operating temperature range (-40C to +85C), while being more compact and lighter than earlier models. It supports a broad spectrum of frame rates (from 1Hz to 50 Hz) and allows vision up to 150 metres. “These new and improved features of the Micro80 Gen2 address the needs of large-volume production processes. This means that it is not only ideal for the small-resolution thermography and short-distance surveillance markets, but can also open up new industries for Ulis,” said Cyrille Trouilleau, product manager at Ulis. “The introduction of these novel characteristics is the first step towards the widespread use of thermal sensors in smart building management systems.” Their new multifunctional thermal sensor offers reliability thanks to the 80x80 pixel ratio. It can distinguish humans from animals or robots in all-weather and lighting conditions, 24/7 – without compromising privacy. This makes it ideal for occupancy detection in connected buildings, amongst other potential applications.