Fully-insulated IGBT Copack solution offers top thermal and mechanical properties

MSC Technologies now supplies the new isolated IXYS IGBT Copack ITF48IF1200HR, consisting of a fast 1200V short circuit rated (10µs) Trench IGBT chip with a current capability of 48A (at TC = 100C) and a similar rated 48A fast Sonic soft-recovery freewheeling diode packed in a rearside-isolated TO-247 for screw mounting. The turn-off Energy Eoff is stated with 2.4mJ per pulse, rated at 40A of switching current and a bus voltage of 600V at a junction temperature TJ = 150°C. Due to the IXYS patented DCB leadframe technology (Direct Copper Bonding) there is no need for the usual standard copper leadframe, having instead a backside-isolated (3kVAC at t=1min) solution with best thermal and mechanical behaviour. Compared with unisolated standard solutions from other manufacturers the thermal resistance is significantly reduced because there is no need for additional interface material for isolating the backside. The similar expansion coefficient of the DCB and the Si-Chip leading into very low mechanical stress and high thermal cycling capability and therefore long term reliability is ensured. Additionally the manufacturing process handling can be simplified and accelerated with increasing quality because there is no special care needed for applying any interface material between heatsink and device. The standard unisolated TO-247 can be easily changed to an isolated DCB solution due to the same mechanical dimensions having all advantages without any mechanical adjustments. The ITF48IF1200HR is well suited to cost-sensitive applications having high requirements concerning reliability like UPS, SMPS, Inverter, generators, welding as well as automotive and aerospace systems, says the company.