New right-angle 0.8mm pitch socket array ideal for micro backplane applications

09-11-2015 | Samtec | Connectors, Switches & EMECH

Samtec’s new right-angle Searay 0.8mm pitch socket array is ideal for micro backplane applications offering up to 50 percent board space savings compared to 1.27mm pitch interconnects.

The open pin field design allows for maximum grounding and routing flexibility with up to 500 total Edge Rate contacts. The ultra high-density right-angle socket array (SEAF8-RA Series) features a choice of 8 or 10 rows, up to 50 contacts per row and high speed performance of 28+ Gbps. Optional guide post holes are available for blind mating. Individual high power modules with press fit tails (UBPT/UBPS Series) are an add-on option for even greater system flexibility.

Additionally, the mating micro coax cable assembly (ESCA Series) features 34 AWG micro ribbon coax cable, a signal to ground ratio of 4:1 and optional screw downs. The Edge Rate contact system increases cycle life and minimizes the effects of broadside coupling, which decreases crosstalk for superior signal integrity performance and impedance control.

This rugged contact system is also less prone to damage when 'zippered' during un-mating. Standard lead-free solder charge terminations simplify IR reflow termination and improve solder joint reliability. Searay products are the industry’s largest offering of high speed, high density open pin field arrays. They support 28+ Gbps applications and are also Final Inch certified for Break Out Region trace routing recommendations to save designers time and costs, says the company.

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