Advanced new thermal management material for semiconductors

07-10-2015 | Honeywell | New Technologies

Honeywell Electronic Materials has announced the availability of Honeywell PTM6000 Phase Change Material (PCM). It is the latest in the company's line of thermal interface materials (TIMs) which are used to transfer and dissipate heat from advanced semiconductor devices.

"More and more, device manufacturers need thermal management materials that provide high-end performance and long lasting reliability," said Olivier Biebuyck, vice president and general manager, Honeywell Electronic Materials. "Prior thermal management options often forced manufacturers to choose between immediate performance needs and overall reliability. PTM6000 has been designed and tested to meet both of these needs."

Honeywell is a recognized leader in developing thermal management solutions. Honeywell's proven PTM and PCM series of thermal management materials are based on sophisticated phase-change chemistry and advanced filler technology that was developed specifically for high-performing electronic devices. The TIMs technology transfers thermal energy from the chip to the heat sink or spreader, where it is dissipated into the surrounding environment. This functionality keeps the chip cool while allowing the heat sink module to perform optimally. The company's patented formulations provide long-lasting chemical and mechanical stability, enabling consistently higher thermal performance compared with alternative thermal interface materials that break down or dry out.


By Electropages Admin