Space-saving Micro SFP+ connectors and cable assemblies
14-09-2015 |
Mouser Electronics
|
Connectors, Switches & EMECH
Mouser is now stocking TE Connectivity's (TE) micro SFP+ connector and cable
assemblies which offer a footprint that is up to 50 percent smaller than
current SFP+ interconnects, helping designers increase faceplate density
while freeing additional PCB space. The products' design has been enhanced
to improve signal routing, minimize electromagnetic interference (EMI), and
optimize automated manufacturing processes.
TE's micro SFP+ connector and cable assemblies, now available from Mouser
Electronics, take up as little as 15 mm of board space, with one micro SFP+
connector freeing up to 19 percent more faceplate space than a single SPF+
connector. The cable assembly and connector provide a staggered contact
configuration that helps improve signal routing, and the 22-position
connector supports data rates up to 10 Gbps. The integrated connector and
cage with solder tail is designed for one-step board placement, and the
connector can withstand up to 265 degrees Celsius for high-temperature
pin-in-paste soldering. The AWG 26 cable features a 360-degree braid crimp
and an extended shield to minimize EMI.
TE's micro SFP+ connector and cable assemblies are electrically compliant to
SFF-8431 and support a number of protocols including 10 Gigabit Ethernet,
Gigabit Ethernet, and Fibre Channel over Ethernet (FCoE). The micro SFP+
interconnects are designed for telecommunications, data communication,
medical diagnostic equipment, and networking applications.