New high-density low-profile integrated VIA PFM AC/DC front-end power modules

19-05-2015 | Vicor | Power

Vicor has unveiled its new high-density low-profile, integrated VIA PFM AC-DC front-end power modules. The converter modules achieve a power density of 8 W/cm³ (127 W/in³) supplying an isolated, PFC regulated 24V or 48V SELV DC output at up to 400W from the universal AC input range of 85 to 264V with 93% peak efficiency. The VIA PFM is 5X thinner than traditional 1U supplies, offering unique design advantages to power system architects challenged by size constraints. With its 9 mm thin profile and 36 mm width, the VIA PFM can be mounted on the sidewall of any typical 1U chassis, saving valuable real estate. Thermally adept VIA PFMs may be chassis mounted and conduction cooled to eliminate fans, thereby improving overall system reliability and further minimising the power system footprint. High density, high efficiency and low thermal resistance make VIA PFM front-end modules well-suited for a wide range of end-market applications, including small cell wireless base stations, size constrained LED lighting applications, industrial and automation systems. VIA power modules enable power system designers to create highly dense, efficient, flexible and scalable power systems. Vicor’s 9 mm thin VIA power modules integrate system functions including EMI filtering, transient protection and inrush current limiting to reduce design time and design risk. Available in chassis-mount and PCB-mount configurations, VIA power modules support a multiplicity of mechanical mounting and thermal management options. Vicor’s online PowerBench design tool suite enables designers to model a complete AC to PoL power system with a modular power component design methodology. The PowerBench tool suite provides the ability to quickly configure and visualise end-to-end power systems and dynamically analyse system performance, accelerating design cycles and reducing development costs, says the company.

By Electropages Admin